KYOTO ELECTRONICS MANUFACTURING CO., LTD.

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Features by device type

Features by device type

Type QTM-500 LFA-502
Principle of measurement heat wire probe method laser flash method
Standard JIS R2618 fire resistant brick thermal conductivity rate measurement method improved version JIS R1611 ceramics coefficient of thermal diffusivity measurement
Item for measurement thermal conductivity rate thermal conductivity rate coefficient of thermal diffusivity/specific heat・thermal conductivity rate (calculation)
Sample rubber, plastics, glass, powders metals, alloys, ceramics, carbon materials
Sample size 100×50mm or more Thickness of 10mm or more (in measurement of sheet materials, room temperature of approx. 0.035 – 5W by a 30μm – 10mm thermal conductivity rate) see note 1 Φ5, □5 or Φ10 thickness 1 – 3mm
Thermal conductivity rate 0.023~12W/m・K 0.2~400W/m・K
Measurement precision Within ±5% of Ref. Within±7%
Reproducibility Within ±3% of Ref. within 5% by CV value
Measurement time 60 sec. 1 second or less
Measurement temperature range -10~200°C see note 2 room temperature – 1500°C
Features Press sensor to surface of sample, and it can be measured in 60 seconds. If larger than the above sizes, there is no need for processing of sample. coefficient of thermal diffusivity and specific heat can be simultaneously measured. improves precision and reliability of calculation of thermal conductivity rate.

(note 1) separate options, computers necessary

(note 2) separate constant temperature bath needed for non-room temperature